Sensor package, method of manufacturing the same, and method of manufacturing lid structure

ABSTRACT

Disclosed are sensor packages, methods of manufacturing the same, and methods of manufacturing lid structures. The sensor package comprises a package substrate, a gas sensor on the package substrate, a lid on the package substrate and having a hole extending between a first inner surface and a first outer surface of the lid, the first inner surface of the lid facing toward the package substrate and the first outer surface of the lid facing away from the package substrate, and a waterproof film in the hole of the lid. The waterproof film is formed on the first inner surface and the first outer surface of the lid.

CROSS-REFERENCE TO RELATED APPLICATIONS

This U.S. nonprovisional application is a continuation of and claimspriority to U.S. patent application Ser. No. 16/131,467 filed on Sep.14, 2018, which claims priority under 35 U.S.C § 119 to Korean PatentApplication No. 10-2017-0175809 filed on Dec. 20, 2017, in the KoreanIntellectual Property Office, the entire contents of each of which arehereby incorporated by reference.

BACKGROUND

Example embodiments according to inventive concepts relate to a sensorpackage, and more particularly, to a sensor package provided with awaterproof film.

A gas sensor measures the amount of an analysis target gas by usingcharacteristics of changes in electrical conductivity or electricalresistance in accordance with adsorption of molecules of the analysistarget gas. The gas sensor may be manufactured using metal oxidesemiconductor, solid electrolyte material, or other organic materials.The gas sensor may be required to have improved accuracy with importanceof recent environmental issues and development of industry.

SUMMARY

Some embodiments of inventive concepts provide a sensor package havingimproved sensing accuracy and a method of manufacturing the same.

According to exemplary embodiments of inventive concepts, a sensorpackage may comprise: a package substrate; a gas sensor on the packagesubstrate; a lid on the package substrate and positioned over the gassensor, the lid having a hole extending between a first inner surfaceand a first outer surface of the lid, the first inner surface of the lidfacing toward the package substrate and the first outer surface of thelid facing away from the package substrate; and a waterproof film in thehole of the lid, wherein the waterproof film is formed on the firstinner surface and the first outer surface of the lid.

According to exemplary embodiments of inventive concepts, a method ofmanufacturing a sensor package may comprise: preparing a lid structure;and placing the lid structure on a package substrate. The lid structuremay comprise: a lid having a hole extending between an inner surface andan outer surface of the lid, the inner surface of the lid facing towardthe package substrate and the outer surface of the lid facing away fromthe package substrate; and a waterproof film in the hole and formed onthe inner surface and the outer surface of the lid.

According to exemplary embodiments of inventive concepts, a method ofmanufacturing a lid structure may comprise: preparing a lid having ahole extending between an inner surface and an outer surface of the lid;filling the hole with a waterproof solution by placing a portion of thelid into the waterproof solution; and curing the waterproof solution toform a waterproof film in the hole.

BRIEF DESCRIPTION OF THE DRAWINGS

Example embodiments will be more clearly understood from the followingdetailed description taken in conjunction with the accompanyingdrawings. FIGS. 1 to 6 represent non-limiting, example embodiments asdescribed herein.

FIG. 1 illustrates a plan view showing a sensor package according toexemplary embodiments.

FIGS. 2A to 2C illustrate cross-sectional views showing a method ofmanufacturing a sensor package according to exemplary embodiments.

FIGS. 3A to 3D illustrate cross-sectional views showing a method ofmanufacturing a sensor package according to exemplary embodiments.

FIGS. 4A to 4D and 4F illustrate cross-sectional views showing a methodof manufacturing a sensor package according to exemplary embodiments.

FIG. 4E illustrates a cross-sectional view showing a lid structureaccording to exemplary embodiments.

FIGS. 5A to 5D illustrate cross-sectional views showing a method ofmanufacturing a sensor package according to exemplary embodiments.

FIG. 6 illustrates a plan view showing a sensor package according toexemplary embodiments.

DETAILED DESCRIPTION OF EMBODIMENTS

It will be described hereinafter exemplary embodiments of inventiveconcepts with reference to the accompanying drawings. Like referencenumerals may indicate like components throughout the description.

A sensor package and its manufacturing method according to inventiveconcepts will now be described below.

FIG. 1 illustrates a plan view showing a sensor package according toexemplary embodiments.

Referring to FIG. 1, a sensor package 10 may include a package substrate100, a sensing device 220, and a lid structure 500. The sensor package10 may be a gas sensor package for sensing gases. The package substrate100 may include, for example, a printed circuit board (PCB). An upperconductive pad 110 and a lower conductive pad 120 may be respectivelydisposed on top and bottom surfaces of the package substrate 100. Theupper conductive pad 110 may be electrically connected through aninternal wiring line to the lower conductive pad 120. In figures, adotted line schematically indicates an internal wiring line within thepackage substrate 100. The lower conductive pad 120 may be coupled to anexternal device.

A plurality of devices 210 and 220 may be disposed on the packagesubstrate 100. The devices 210 and 220 may include a control device 210(e.g., control circuitry) and a sensing device 220 (e.g., sensingcircuitry). The control device 210 may include a semiconductor chip. Thecontrol device 210 may include a plurality of integrated circuits suchas complementary metal-oxide-semiconductor (CMOS) transistors. Thecontrol device 210 may control the sensing device 220. The controldevice 210 may be electrically connected through a bonding wire 230 tothe upper conductive pad 110. The sensing device 220 may be stacked on atop surface of the control device 210. For example, the sensing device220 may include a gas sensor chip for sensing gases. The sensing device220 may have a top surface serving as a sensing face. The sensing device220 may be electrically connected through the bonding wire 230 to thecontrol device 210. The sensing device 220 may be electrically connectedthrough the control device 210 to the upper conductive pad 110.

According to exemplary embodiments, an electrical connection of thedevices 210 and 220 may be achieved in various manners. For example, oneor more of the control device 210 and the sensing device 220 may beelectrically flip-chip connected to the package substrate 100. In thisdescription, the phrase “electrically connected to the control device210/sensing device 220” may mean “electrically connected to integratedcircuits of the control device 210/sensing device 220.” An arrangementof the devices 210 and 220 may be diversely changed. For example, thesensing device 220 and the control device 210 may be laterally spacedapart from each other on the package substrate 100. The sensing device220 may be provided in plural. In some embodiments, for another example,the control device 210 may not be provided, and instead the sensingdevice 220 may further serve as the control device 210. The controldevice 210 and the sensing device 220 will be further discussed below,but inventive concepts are not limited to the following description.

The various pads (110, 120) of a device described herein may beconductive terminals connected to internal wiring of the device, and maytransmit signals and/or supply voltages between an internal wiringand/or internal circuit of the device and an external source. Forexample, chip pads of a semiconductor chip may electrically connect toand transmit supply voltages and/or signals between an integratedcircuit of the semiconductor chip and a device to which thesemiconductor chip is connected. The various pads may be provided on ornear an external surface of the device and may generally have a planarsurface area (often larger than a corresponding surface area of theinternal wiring to which they are connected) to promote connection to afurther terminal, such as a bump or solder ball, and/or an externalwiring.

The lid structure 500 may be disposed on the package substrate 100. Thelid structure 500 may include a lid 300 and a waterproof film 400. Theterm “waterproof film” as used herein may refer to a film that may allowa gas to pass through, but not allow impurities to pass through. Thepackage substrate 100 and the lid 300 may define a cavity 195therebetween. For example, the cavity 195 may be a space surrounded bythe package substrate 100 and the lid 300. The cavity 195 may beoccupied by a gas. The gas may include an analysis target material. Thelid 300 may include a metal, a plastic, or a liquid-crystal polymer. Thelid 300 may protect the devices 210 and 220 from external stresses. Theexternal stresses may be or include, for example, physical impact orimpurities. The impurities may include moisture and/or dust.

The lid 300 may include a first portion 310 and a second portion 320.The second portion 320 of the lid 300 may be provided between the firstportion 310 and the package substrate 100. The second portion 320 of thelid 300 may support the first portion 310. The upper portion of thesecond portion 320 of the lid 300 may be connected to the first portion310 and the lower portion of the second portion 320 may be connected tothe upper surface of the package substrate 100. In some embodiments, thefirst portion 310 and the second portion 320 may be integrally formed asa single unit to form the lid 300. The first portion 310 may extendinward parallel to the upper surface of the package substrate 100 andthe second portion 320 may extend vertically from the upper surface ofthe package substrate 100 to be connected to the first portion 310thereby forming an upside down L-shaped lid 300.

For example, the lid 300 may have a first inner surface 300 b, a firstouter surface 300 a, a second inner surface 300 c, and a second outersurface 300 d. The first inner surface 300 b of the lid 300 may standfacing toward the package substrate 100. The first outer surface 300 amay be opposite to the first inner surface 300 b facing away from thepackage substrate 100. The first outer surface 300 a of the lid 300 maycorrespond to an uppermost surface of the lid 300. The second outersurface 300 d of the lid 300 may correspond to an outer sidewall of thelid 300. For example, the lid 300 may have an edge provided at alocation the first outer surface 300 a meets the second outer surface300 d. The second outer surface 300 d of the lid 300 may include a firstsub-outer surface 310 d and a second sub-outer surface 320 d. The firstsub-outer surface 310 d may correspond to an outer sidewall of the firstportion 310, and the second sub-outer surface 320 d may correspond to anouter sidewall of the second portion 320. The second sub-outer surface320 d may be closer than the first sub-outer surface 310 d to thepackage substrate 100. For example, the first sub-outer surface 310 dmay correspond to an outer sidewall of an upper portion (e.g., the firstportion 310) of lid 300, and the second sub-outer surface 320 d maycorrespond to an outer sidewall of a lower portion (e.g., the secondportion 320) of the lid 300 that connects the uppermost surface of thelid 300 to the package substrate 100. The second sub-outer surface 320 dmay be connected to the first sub-outer surface 310 d. The second innersurface 300 c of the lid 300 may face the second outer surface 300 d.The second inner surface 300 c of the lid 300 may correspond to an innersidewall of the lid 300. The second inner surface 300 c of the lid 300may include a first sub-inner surface 310 c and a second sub-innersurface 320 c. The first sub-inner surface 310 c may face the firstsub-outer surface 310 d. The first sub-inner surface 310 c maycorrespond to the outer sidewall of the first portion 310. The secondsub-inner surface 320 c may be connected to the first sub-inner surface310 c. The second sub-inner surface 320 c may face the second sub-outersurface 320 d. The second sub-inner surface 320 c may correspond to theouter sidewall of the second portion 320.

The lid 300 may include at least one hole 390. The hole 390 maypenetrate the first inner surface 300 b and the first outer surface 300a. Differently from that shown, the hole 390 may be provided in plural.

The waterproof film 400 may be provided in the hole 390. The waterprooffilm 400 may fill, for example, the hole 390. The waterproof film 400may cover the first portion 310 of the lid 300. For example, thewaterproof film 400 may extend onto the first outer surface 300 a, thefirst inner surface 300 b, and the first sub-inner surface 310 c of thelid 300. The waterproof film 400 may further extend onto the firstsub-outer surface 310 d. The waterproof film 400 may expose the secondportion 320 of the lid 300. For example, the waterproof film 400 may notcover the second sub-inner surface 320 c and the second sub-outersurface 320 d of the lid 300.

When an external material enters the cavity 195, it may be required thatthe external material pass through the waterproof film 400 provided inthe hole 390. The external material may include a gas and impurities.The impurities may include moisture and/or dust. The gas may include ananalysis target material. The waterproof film 400 may allow the gas topass through and enter the cavity 195. The sensing device 220 may sensethe entered gas. The impurities may have difficulty in passing throughthe waterproof film 400. The occurrence of sensing noise due to theimpurities may thus be prevented to improve sensing accuracy of thesensing device 220. It may be possible to prevent or reduceimpurity-induced damages to the sensing device 220.

The phrase “passing through the waterproof film 400” may mean “passingthrough pores (not shown) of the waterproof film 400.” When the pores ofthe waterproof film 400 have a diameter less than about 0.1 μm, the gasmay have difficulty in passing through the waterproof film 400. When thepores of the waterproof film 400 have a diameter greater than about 10μm, the impurities may pass through the waterproof film 400. In someembodiments, the pores of the waterproof film 400 may have a diameterranging from about 0.1 μm to about 10 μm. The waterproof film 400 mayaccordingly allow the gas to pass through, but not allow the impuritiesto pass through.

In some embodiments, a material of the waterproof film 400 may beproperly chosen to select substance passing through the waterproof film400. For example, the waterproof film 400 may include a hydrophobicpolymer to prevent the cavity 195 from receiving hydrophilic impuritiessuch as moisture. The hydrophobic polymer may include, for example,poly(tetrafluoroethylene) (hereinafter referred to as “PTFE”).

A thickness T of the waterproof film 400 may be appropriately adjustedto select substance passing through the waterproof film 400. Thewaterproof film 400 may include a portion provided in the hole 390, anda thickness of the portion may correspond to the thickness T of thewaterproof film 400. When the thickness T of the waterproof film 400 isless than about 10 μm, the waterproof film 400 may allow the impuritiesto pass through or may decrease in strength. When the thickness T of thewaterproof film 400 is greater than about 500 μm, the gas may havedifficulty in passing through the waterproof film 400. In someembodiments, the thickness T of the waterproof film 400 may fall withina range from about 10 μm to about 500 μm. The waterproof film 400 maythus selectively allow the gas to pass through. The waterproof film 400may be homogenously formed of the same material.

A connection member 130 may be provided between the package substrate100 and the lid 300. The connection member 130 may include an adhesiveor solder. The connection member 130 may seal a gap between the packagesubstrate 100 and the lid 300. As such, no external impurities may beintroduced into the cavity 195. Differently from that shown, theconnection member 130 may be shaped like a solder ball or bump. The lid300, together with the package substrate 100 and connection member 130,may encapsulate the devices 210 and 220 and seal the same within cavity195. With the exception of gas allowed to pass through waterproof film400, the cavity may be hermetically sealed and thus only allow gas toflow in an out of cavity 195 via pores of the waterproof film 400.

Hereinafter, it will be described methods of manufacturing sensorpackages according to exemplary embodiments. In the description of themanufacturing methods, top and bottom surfaces will be defined based onthe sensor package of FIG. 1.

FIGS. 2A to 2C illustrate cross-sectional views showing a method ofmanufacturing a sensor package according to exemplary embodiments. Inthe embodiment that follows, a description duplicate with theaforementioned will be omitted.

Referring to FIG. 2A, a lid 300 may be provided in a waterproof solution405. A container 600 may be provided to accommodate the waterproofsolution 405. The waterproof solution 405 may include a hydrophobicpolymer such as PTFE. A first portion 310 of the lid 300 may be providedin the waterproof solution 405. The providing of the lid 300 maycontinue until a first inner surface 300 b and a first outer surface 300a of the lid 300 are immersed in the waterproof solution 405. A hole 390may thus be filled with the waterproof solution 405. A second portion320 of the lid 300 may not be immersed in the waterproof solution 405.

Referring to FIG. 2B, the waterproof solution 405 of FIG. 2A may becured to form a waterproof film 400. The curing of the waterproofsolution 405 may be performed by thermal curing or optical curing. Thewaterproof film 400 may be formed in the hole 390 and on the first innersurface 300 b, the first outer surface 300 a, and a first sub-outersurface 310 d of the lid 300. The waterproof film 400 may further extendonto the first sub-outer surface 310 d of the lid 300. Since thewaterproof solution 405 is cured to form the waterproof film 400, theformation of the waterproof film 400 may have no limitation due to adiameter of the hole 390 and/or the number of the hole 390. Thewaterproof film 400 may thus be manufactured in a simplified process.

Referring to FIG. 2C, the waterproof film 400 may be separated from thecontainer 600, with the result that a lid structure 500 may befabricated. The waterproof film 400 may be physically separated from thecontainer 600. The lid structure 500 may include the lid 300 and thewaterproof film 400.

Referring back to FIG. 1, devices 210 and 220 may be mounted on apackage substrate 100. The lid structure 500 may be disposed on thepackage substrate 100 in such a way that the first inner surface 300 bof the lid 300 may face the package substrate 100 and may extendparallel to the upper surface of the package substrate 100. A connectionmember 130 may be formed between the package substrate 100 and the lid300, such that the lid 300 may be fixed on the package substrate 100.Through the aforementioned exemplary processes, a sensor package 10 maybe eventually manufactured.

FIGS. 3A to 3D illustrate cross-sectional views showing a method ofmanufacturing a sensor package according to exemplary embodiments. Inthe embodiment that follows, a description duplicate with theaforementioned will be omitted.

Referring to FIG. 3A, a container 600 having protrusions 680 may beprepared. The container 600 may have the protrusions 680 on its innersurface 600 b. A waterproof solution 405 may be provided on the innersurface 600 b of the container 600. A lid 300 may be provided in thecontainer 600, and thus a first portion 310 of the lid 300 may beimmersed in the waterproof solution 405. In this step, the lid 300 maybe disposed on and in physical contact with the protrusions 680. Theprotrusions 680 may cause the lid 300 to be spaced apart at apredetermined interval from the inner surface 600 b of the container600. The waterproof solution 405 may fill a gap between the container600 and the lid 300. The number and shape of the protrusions 680 may notbe limited to that shown, but variously changed.

Referring to FIG. 3B, the waterproof solution 405 may be cured to form awaterproof film 400. The waterproof film 400 may have recesses 380. Therecesses 380 may be formed by the protrusions 680 of the container 600.The recesses 380 may be provided on a top surface 400 a of thewaterproof film 400. The recesses 380 may further be formed on an outersurface 400 d of the waterproof film 400. In contrast, the recesses 380may not be formed on a bottom surface 400 b of the waterproof film 400.In this exemplary embodiment, the top surface 400 a of the waterprooffilm 400 may face away from the first inner surface 300 b of the lid 300and the first inner surface 300 b of the lid 300 may face toward thebottom surface 400 b.

Referring to FIG. 3C, the waterproof film 400 may be separated from thecontainer 600, with the result that a lid structure 501 may befabricated. The lid structure 501 may include the lid 300 and thewaterproof film 400. A first outer surface 300 a of the lid 300 may bepartially exposed to the recesses 380. A first sub-outer surface 310 dof the lid 300 may be partially exposed to the recesses 380.

Referring back to FIG. 3D, a package substrate 100 may be prepared tohave devices 210 and 220 mounted thereon. The lid structure 501 may bedisposed on the package substrate 100, which step may manufacture asensor package 11.

FIGS. 4A to 4D and 4F illustrate cross-sectional views showing a methodof manufacturing a sensor package according to exemplary embodiments. Inthe embodiment that follows, a description duplicate with theaforementioned will be hereinafter omitted.

Referring to FIG. 4A, a surface treatment process may be performed on afirst portion 310 of a lid 300. An etchant may be used to perform thesurface treatment process on the lid 300. For example, the first portion310 of the lid 300 may be provided in the etchant. The etchant mayinclude an acid solution. For example, the acid solution may includesulfuric acid, nitric acid, hydrochloric acid, or a mixture thereof. Foranother example, a plasma treatment process may be used to perform thesurface treatment process. The plasma treatment process may be an oxygenplasma treatment process. The surface treatment process may increase asurface roughness of the first portion 310 of the lid 300. The surfaceroughness of the first portion 310 of the lid 300 may fall within arange from about 30 nm to about 50 μm. According to exemplaryembodiments, the surface roughness of the first portion 310 of the lid300 may fall within a range from about 30 nm to about 50 tan as anarithmetic mean roughness (Ra). A second portion 320 of the lid 300 maynot be exposed to the etchant. The surface roughness of the firstportion 310 of the lid 300 may be greater than a surface roughness ofthe second portion 320 of the lid 300. The surface roughness of thefirst portion 310 of the lid 300 may indicate a surface roughness of oneor more of a first sub-inner surface 310 c of the lid 300, a first innersurface 300 b of the lid 300, an inner wall of a hole 390 of the lid300, a first outer surface 300 a of the lid 300, and a first sub-outersurface 310 d of the lid 300. The surface roughness of the secondportion 320 of the lid 300 may indicate a surface roughness of a secondsub-inner surface 320 c of the lid 300 and a second sub-outer surface320 d of the lid 300.

Referring to FIG. 4B, the first portion 310 of the lid 300 may beprovided in a waterproof solution 405. The providing of the waterproofsolution 405 may be substantially the same as that discussed withreference to FIG. 2B.

Referring successively to FIGS. 4C and 4D, the waterproof solution 405may be cured to form a waterproof film 400. The waterproof film 400 maybe formed on the first portion 310 of the lid 300. Since the firstportion 310 of the lid 300 has a great surface roughness, an increasedadhesive force may be provided between the lid 300 and the waterprooffilm 400. For example, an adhesive force may be greater between the lid300 and the waterproof film 400 than between the waterproof film 400 andthe container 600. Due to the difference in adhesive force, thewaterproof film 400 may be easily separated from the container 600. Alid structure 502 may therefore be manufactured to include the lid 300and the waterproof film 400.

FIG. 4E illustrates a cross-sectional view showing a lid structureaccording to exemplary embodiments.

Referring to FIG. 4E, a lid structure 503 may include the lid 300 andthe waterproof film 400. A surface treatment process may be performed onthe lid 300 in manufacturing the lid structure 503. The surfacetreatment process may be performed identically or similarly to thatdiscussed above with reference to FIG. 4A. The surface treatment processmay be performed on the first and second portions 310 and 320 of the lid300. The first and second portions 310 and 320 of the lid 300 may thenhave an increased surface roughness. For example, the surface roughnessof the first and second portions 310 and 320 of the lid 300 may fallwithin a range from about 30 nm to about 50 μm. The waterproof film 400may be formed in the hole 390 and on the first portion 310 of the lid300. Since the lid 300 has a great surface roughness, the waterprooffilm 400 may be easily separated from the container 600 in fabricatingthe waterproof film 400.

Referring back to FIG. 4F, devices 210 and 220 may be mounted on apackage substrate 100. The lid structure 502 may be disposed on thepackage substrate 100. The fabrication of the lid structure 502 may beidentical or similar to that discussed with reference to FIGS. 4A to 4D.For another example, the lid structure 503 of FIG. 4E may be employed.Through the aforementioned exemplary processes, a sensor package 12 maybe eventually manufactured.

FIGS. 5A to 5D illustrate cross-sectional views showing a method ofmanufacturing a sensor package according to exemplary embodiments. Inthe embodiment that follows, a description duplicate with theaforementioned will be omitted.

Referring to FIG. 5A, a container 600 may be prepared to have aseparation assist film 650. The separation assist film 650 may beprovided on an inner surface of the container 600. For example, thecontainer 600 may include a metal, and the separation assist film 650may include a polymer such as polyimide. A waterproof solution 405 maybe provided on the separation assist film 650.

A lid 300 may be prepared to have an adhesion film 350 coated thereon.The adhesion film 350 may be formed on a first portion 310 of the lid300 to cover an inner wall of a hole 390, a first outer surface 300 a ofthe lid 300, a first inner surface 300 b of the lid 300, and a firstsub-inner surface 310 c of the lid 300. The adhesion film 350 mayfurther cover a first sub-outer surface 310 d of the lid 300. Theadhesion film 350 may not be formed on a second portion 320 of the lid300. The adhesion film 350 may include a polymer.

The lid 300 may be provided in the waterproof solution 405. Thewaterproof solution 405 may fill the hole 390 and a gap between theseparation assist film 650 and the adhesion film 350. Before the lid 300is provided in the waterproof solution 405, a surface treatment processmay further be performed as discussed with reference to FIG. 4A or 4D.

Referring successively to FIGS. 5B and 5C, the waterproof solution 405may be cured to form a waterproof film 400. An increased adhesive forcemay be provided between the separation assist film 650 and the container600. For example, an adhesive force may be greater between theseparation assist film 650 and the container 600 than between theseparation assist film 650 and the adhesion film 350. In someembodiments, the adhesion film 350 may not be provided, and in thiscase, an adhesive force may be greater between the separation assistfilm 650 and the container 600 than between the separation assist film650 and the waterproof film 400. The separation assist film 650 mayeasily separate the waterproof film 400 from the container 600. Asillustrated in FIG. 5C, a lid structure 504 may include the adhesionfilm 350 in addition to the lid 300 and the waterproof film 400. Theadhesion film 350 may be interposed between the lid 300 and thewaterproof film 400. The adhesion film 350 may more rigidly adhere thewaterproof film 400 onto the lid 300.

Referring back to FIG. 5D, devices 210 and 220 may be mounted on apackage substrate 100. The lid structure 504 may be disposed on thepackage substrate 100, which step may manufacture a sensor package 13.

FIG. 6 illustrates a plan view showing a sensor package according toexemplary embodiments. In the embodiment that follows, a descriptionduplicate with the aforementioned will be omitted.

Referring to FIG. 6, a sensor package 14 may include a package substrate100, a control device 210, a sensing device 220, a lid structure 500,and an adhesion portion 800. The package substrate 100, the controldevice 210, the sensing device 220, and the lid structure 500 may be thesame as those discussed above with reference to FIG. 1. For example, thelid structure 500 may be substantially the same as the lid structure 500of FIG. 1. For another example, the sensor package 14 may include one ofthe lid structure 501 of FIG. 3C, the lid structure 502 of FIG. 4D, thelid structure 503 of FIG. 4E, and the lid structure 504 of FIG. 5C. Abottom surface 400 b of the waterproof film 400 may face the packagesubstrate 100.

The adhesion portion 800 may be disposed on the bottom surface 400 b ofthe waterproof film 400. The adhesion portion 800 may be in physicalcontact with the bottom surface 400 b of the waterproof film 400 and asecond inner surface 300 c of the lid 300. The adhesion portion 800 maymore rigidly fix the waterproof film 400 to the lid 300. In someembodiments, the adhesion portion 800 may be formed after the waterprooffilm 400 is formed. The formation of the adhesion portion 800 may beperformed before or after the waterproof film 400 is separated from thecontainer 600.

According to inventive concepts, the waterproof film may preventimpurities from entering the hole. It therefore may be possible toprevent or reduce damages to the sensing device and the occurrence ofsensing noise due to the impurities.

In some embodiments, the formation of the waterproof film may includeproviding the lid structure in the waterproof solution and curing thewaterproof solution. The waterproof film may thus be formed in asimplified process. The waterproof film may be formed in a hole of thelid without a limitation of a size of the hole of the lid.

This detailed description of inventive concepts should not be construedas limited to the embodiments set forth herein, and it is intended thatinventive concepts cover the various combinations, the modifications andvariations of this invention without departing from the spirit and scopeof inventive concepts. The appended claims should be construed toinclude other embodiments.

What is claimed is:
 1. A method of manufacturing a lid structure, themethod comprising: preparing a lid including a first portion and asecond portion, the first portion of lid has a hole extending between afirst inner surface and an first outer surface of the lid; filling thehole with a waterproof solution by placing the first portion of the lidinto the waterproof solution; and curing the waterproof solution to forma waterproof film in the hole, wherein the waterproof film is formed inthe hole and on the first inner surface and the first outer surface ofthe lid, wherein the lid has the first inner surface, the first outersurface, a second outer surface, and an outer edge, the outer edgeprovided at a location where the first outer surface meets the secondouter surface, and wherein the second outer surface of the lidcorresponds to an outer sidewall of the lid.
 2. The method of claim 1,wherein the second portion of the lid is not immersed in the waterproofsolution during the placing the first portion of the lid into thewaterproof solution.
 3. The method of claim 2, wherein the second outersurface of the lid comprises a first sub-outer surface and a secondsub-outer surface, wherein the first sub-outer surface is providedbetween the second sub-outer surface and the outer edge of the lid, andwherein the placing the first portion of the lid into the waterproofsolution comprises immersing the first sub-outer surface of the lid inthe waterproof solution without immersing the second sub-outer surfaceof the lid.
 4. The method of claim 3, further comprising: performing asurface treatment process on the first portion of the lid to increase asurface roughness of the first portion of the lid, wherein the secondportion of the lid is not exposed to the surface treatment process. 5.The method of claim 1, wherein preparing the lid structure furthercomprises: adding the waterproof solution to a container, the containerhaving protrusion on an inner surface thereof; and placing the lid onthe protrusion to cause the lid to come into contact with theprotrusion.
 6. The method of claim 5, further comprising: separating thewaterproof film from the container, after the separating the waterprooffilm from the container, the waterproof film having a recess on a topsurface thereof, the recess corresponding to the protrusion of thecontainer.
 7. The method of claim 1, wherein the waterproof filmcomprises a hydrophobic polymer.
 8. The method of claim 1, wherein thepreparing the lid further comprises providing an adhesion film on thefirst portion of the lid, wherein the adhesion film is provided betweenthe lid and the waterproof film, after the curing the waterproofsolution.
 9. The method of claim 8, further comprising: preparing acontainer and a separation assist film, the separation assist filmprovided on an inner surface of container; and adding the waterproofsolution on the separation assist film in the container, wherein afterthe curing the waterproof solution, an adhesive force between theseparation assist film and the container is greater than an adhesiveforce between the separation assist film and the waterproof film.
 10. Amethod of manufacturing a lid structure, the method comprising:preparing a lid, the lid having: a first inner surface; a first outersurface opposite to the first inner surface; a second inner surfacecorresponding an inner sidewall of the lid; a second outer surfaceopposite to the second inner surface, the second outer surface includinga first sub-outer surface and a second sub-outer surface; an outer edgeprovided at a location where the first outer surface meets the secondouter surface, the first sub-outer surface provided between the outeredge and the second sub-outer surface; and a hole extending between thefirst inner surface and the first outer surface; and filling the holewith a waterproof solution by placing a portion of the lid into thewaterproof solution; and curing the waterproof solution to form awaterproof film in the hole, wherein the waterproof film is formed inthe hole and provided on the first inner surface, the first outersurface, the outer edge, and the first sub-outer surface of the lid,wherein the second sub-outer surface is exposed by the waterproof film,wherein the waterproof film comprises a hydrophobic polymer, and whereinthe waterproof film has pores, each of the pores having a diameterranging from 0.1 μm to 10 μm.
 11. A method of manufacturing a sensorpackage, the method comprising: preparing a lid structure; and placingthe lid structure on a package substrate, wherein the lid structurecomprises: a lid having a hole extending between a first inner surfaceand a first outer surface of the lid, the first inner surface of the lidfacing toward the package substrate and the first outer surface of thelid facing away from the package substrate; and a waterproof film in thehole and on the first inner surface and the first outer surface of thelid.
 12. The method of claim 11, where the lid comprises: a firstportion covered by the waterproof film and having the first innersurface and the first outer surface; and a second portion exposed by thewaterproof film, wherein the second portion of the lid is providedbetween the first portion of the lid and the package substrate.
 13. Themethod of claim 11, wherein the lid further has a second outer surfaceand an outer edge, the outer edge provided at a location that the firstouter surface meets the second outer surface, wherein the second outersurface of the lid comprises a first sub-outer surface and a secondsub-outer surface, wherein the first sub-outer surface is providedbetween the second sub-outer surface and the outer edge of the lid, and,wherein the waterproof film covers the first sub-outer surface andexposes the second sub-outer surface of the lid.
 14. The method of claim13, wherein the first sub-outer surface of the lid has a surfaceroughness greater than a surface roughness of the second sub-outersurface of the lid.
 15. The method of claim 14, the surface roughness ofthe first sub-outer surface of the lid falls within a range from about30 nm to about 50 μm.
 16. The method of claim 11, wherein the waterprooffilm has a recess on a surface thereof, and wherein the recess exposesthe first outer surface of the lid.
 17. The method of claim 11, whereinthe lid structure further comprises an adhesion film between the lid andthe waterproof film.
 18. The method of claim 11, further comprising:mounting a control device on the package substrate; and mounting gassensors on the control device.
 19. The method of claim 11, wherein thewaterproof film has pores, each of the pores having a diameter rangingfrom 0.1 μm to 10 μm, and wherein the waterproof film has a thicknessranging from 10 μm to 500 μm in the hole.
 20. The method of claim 11,wherein the waterproof film comprises poly(tetrafluoroethylene).